Interposers providing electric and optical feed-through
This presentation will share lessons learned by CMC Microsystems and collaborators from hybrid integration of electrical and optical ICs, including CMOS-PIC chip stacking, laser integration on PIC, and the development of a new low-cost multi-user silicon interposer platform. The discussion will lay the groundwork for an exchange about the need and feasibility of developing interposer technology in Canada.
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